- Patent Title: Electronic device and method for manufacturing electronic device
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Application No.: US15757947Application Date: 2016-12-26
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Publication No.: US10347555B2Publication Date: 2019-07-09
- Inventor: Hideki Kamada
- Applicant: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Current Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Ladas & Parry, LLP
- International Application: PCT/JP2016/088630 WO 20161226
- International Announcement: WO2018/122897 WO 20180705
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L23/24 ; H01L23/00 ; H01L21/56 ; H01L23/28

Abstract:
An electronic device has a substrate 10, an electronic element 80 provided on the substrate 10 and a sealing part 20 for sealing the electronic element 80. The sealing part 20 has an insertion part 22 for inserting a fastening member 90. The insertion part 22 is provided in a sealing recessed part 25 recessed compared with a circumferential region. At least side surface and the sealing recessed part 25 of the sealing part 20 are exposed to the outside.
Public/Granted literature
- US20180342436A1 ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE Public/Granted day:2018-11-29
Information query
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