Invention Grant
- Patent Title: Wiring board, electronic device, and electronic module
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Application No.: US15761977Application Date: 2016-10-21
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Publication No.: US10347557B2Publication Date: 2019-07-09
- Inventor: Kouichi Kawasaki
- Applicant: KYOCERA Corporation
- Applicant Address: JP Kyoto-Shi, Kyoto
- Assignee: KYOCERA CORPORATION
- Current Assignee: KYOCERA CORPORATION
- Current Assignee Address: JP Kyoto-Shi, Kyoto
- Agency: Volpe and Koenig, P.C.
- Priority: JP2015-210924 20151027
- International Application: PCT/JP2016/081310 WO 20161021
- International Announcement: WO2017/073486 WO 20170504
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L23/36 ; H01L23/12 ; H01L23/498
Abstract:
The wiring board includes an insulating substrate having a main surface, an external electrode on the main surface and an outer edge portion of the insulating substrate, and a dissipating metal layer on the main surface of the insulating substrate, the dissipating metal layer having a greater area than the external electrode if viewed in a plan, the dissipating metal layer being adjacent to the external electrode and having a slit. The slit has an opening at an outer periphery of the dissipating metal layer. The external electrode faces the opening.
Public/Granted literature
- US20180286777A1 WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE Public/Granted day:2018-10-04
Information query
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