- Patent Title: Carrier and clip each having sinterable, solidified paste for connection to a semiconductor element, corresponding sintering paste, and corresponding production method and use
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Application No.: US15129250Application Date: 2015-03-26
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Publication No.: US10347566B2Publication Date: 2019-07-09
- Inventor: Michael Benedikt , Thomas Krebs , Michael Schäfer , Wolfgang Schmitt , Andreas Hinrich , Andreas Klein , Alexander Brand , Martin Bleifuss
- Applicant: HERAEUS DEUTSCHLAND GMBH & CO. KG
- Applicant Address: DE Hanau
- Assignee: HERAEUS DEUTSCHLAND GMBH & CO. KG
- Current Assignee: HERAEUS DEUTSCHLAND GMBH & CO. KG
- Current Assignee Address: DE Hanau
- Agency: Shakir Law PLLC
- Agent Hassan Abbas Shakir
- Priority: DE102014104272 20140326
- International Application: PCT/EP2015/056596 WO 20150326
- International Announcement: WO2015/144833 WO 20151001
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/00 ; H01L21/48
Abstract:
A carrier and the clip are used to produce a packaging having a lead frame by connection to the chip using sintering of the solidified sintering pastes in one work step. The carrier may be a lead frame and a clip for at least one semiconductor element has at least one functional surface for connecting to the semiconductor element and a plurality of connections. The material of the earlier or of the clip includes a metal and a layer made of a solidified sintering paste. The sintering paste may contain silver and/or a silver compound. The sintering paste is arranged on the functional surface. The carrier or clip and the layer made of sintering paste form an intermediate product that can be connected to the semiconductor element.
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