A semiconductor device includes a wiring, a semiconductor chip above the wiring and a metal block above the semiconductor chip. The semiconductor chip includes a semiconductor substrate, a lower electrode, an upper large electrode and an upper small electrode. The semiconductor chip includes a first portion and a second portion, the first portion being on an upper small electrode side with respect to a centroid of the semiconductor chip, the second portion being on an opposite side of the upper small electrode with respect to the centroid. The lower electrode is connected to the wiring via a lower solder layer. The lower solder layer includes a solder base material and metal particles. A volume ratio of the metal particles occupying the lower solder layer under the second portion is higher than a volume ratio of the metal particles occupying the lower solder layer under the first portion.