Invention Grant
- Patent Title: Semiconductor device manufacturing apparatus and method
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Application No.: US15061970Application Date: 2016-03-04
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Publication No.: US10347603B2Publication Date: 2019-07-09
- Inventor: Masayuki Miura
- Applicant: TOSHIBA MEMORY CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TOSHIBA MEMORY CORPORATION
- Current Assignee: TOSHIBA MEMORY CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Kim & Stewart LLP
- Priority: JP2015-097594 20150512
- Main IPC: B23K20/00
- IPC: B23K20/00 ; B23K20/02 ; H01L23/00

Abstract:
A semiconductor device manufacturing apparatus includes a stage, a head section facing the stage and configured to hold a semiconductor element, a driving section configured to drive one of the head section and the stage to move in a first direction intersecting the head section and the stage and apply a load to the other one of the stage and the head section, a load sensor configured to sense a load value of the applied load, and a controller configured to control the driving section to move one of the head section and the stage, and then separate the head section from the stage in accordance with a change in the load value.
Public/Granted literature
- US20160336291A1 SEMICONDUCTOR DEVICE MANUFACTURING APPARATUS AND METHOD Public/Granted day:2016-11-17
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