Invention Grant
- Patent Title: Forming spacer for trench epitaxial structures
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Application No.: US15972547Application Date: 2018-05-07
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Publication No.: US10347632B2Publication Date: 2019-07-09
- Inventor: Injo Ok , Balasubramanian Pranatharthiharan , Soon-Cheon Seo , Charan V. V. S. Surisetty
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Roberts Mlotkowski Safran Cole & Calderon, P.C.
- Agent Steven J. Meyers; Andrew M. Calderon
- Main IPC: H01L21/70
- IPC: H01L21/70 ; H01L27/092 ; H01L21/8238

Abstract:
The disclosure relates to a structure and methods of forming spacers for trench epitaxial structures. The method includes: forming a spacer material between source and drain regions of respective first-type gate structures and second-type gate structures; growing source and drain material about the first-type gate structures, confined within an area defined by the spacer material; and growing source and drain material about the second-type gate structures, confined within an area defined by the spacer material.
Public/Granted literature
- US20180254274A1 SPACER FOR TRENCH EPITAXIAL STRUCTURES Public/Granted day:2018-09-06
Information query
IPC分类: