Invention Grant
- Patent Title: Semiconductor device
-
Application No.: US15808146Application Date: 2017-11-09
-
Publication No.: US10347714B2Publication Date: 2019-07-09
- Inventor: Jun Takaoka
- Applicant: ROHM CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Priority: JP2016-219800 20161110; JP2017-202112 20171018
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/36 ; H01L29/861 ; H01L29/08 ; H01L29/40 ; H01L29/739 ; H01L29/78 ; H01L29/423 ; H01L29/10 ; H01L27/06

Abstract:
A semiconductor device includes a semiconductor layer of a first conductivity type, an impurity region of a second conductivity type formed in a surface layer portion of the semiconductor layer, a terminal region of the second conductivity type that is formed in the surface layer portion of the semiconductor layer along a peripheral edge of the impurity region and that has a second conductivity type impurity concentration higher than a second conductivity type impurity concentration of the impurity region, and a surface electrode that is formed on the semiconductor layer and that has a connection portion connected to the impurity region and to the terminal region.
Public/Granted literature
- US20180130874A1 SEMICONDUCTOR DEVICE Public/Granted day:2018-05-10
Information query
IPC分类: