Invention Grant
- Patent Title: Silicon carbide semiconductor device
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Application No.: US15766424Application Date: 2015-12-07
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Publication No.: US10347724B2Publication Date: 2019-07-09
- Inventor: Rina Tanaka , Katsutoshi Sugawara , Yasuhiro Kagawa , Naruhisa Miura
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Chiyoda-ku
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Chiyoda-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- International Application: PCT/JP2015/084239 WO 20151207
- International Announcement: WO2017/098547 WO 20170615
- Main IPC: H01L29/423
- IPC: H01L29/423 ; H01L29/16 ; H01L29/08 ; H01L29/10 ; H01L29/417 ; H01L29/66 ; H01L29/78

Abstract:
A gate insulating film covers a trench penetrating through a source region and a body region and reaching a drift layer in each of a first cell region and a second cell region. The gate electrode is provided in the trench. A high-concentration layer of the first conductivity type is provided between the drift layer and the body region in the first cell region and has a second impurity concentration higher than the first impurity concentration. A current restriction layer is provided between the drift layer and the body region in the second cell region and has the first conductivity type and a third impurity concentration higher than the first impurity concentration and lower than the second impurity concentration.
Public/Granted literature
- US20180315819A1 SILICON CARBIDE SEMICONDUCTOR DEVICE Public/Granted day:2018-11-01
Information query
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