Invention Grant
- Patent Title: Semiconductor device, power supply circuit, and computer
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Application No.: US15889431Application Date: 2018-02-06
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Publication No.: US10347734B2Publication Date: 2019-07-09
- Inventor: Tatsuo Shimizu , Hisashi Saito , Hiroshi Ono , Toshiya Yonehara
- Applicant: Kabushiki Kaisha Toshiba
- Applicant Address: JP Minato-ku
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Minato-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: H01L29/15
- IPC: H01L29/15 ; H01L29/51 ; H01L29/49 ; H01L29/778 ; H01L21/225 ; H01L21/28 ; H01L29/417 ; H01L29/423

Abstract:
A semiconductor device includes a nitride semiconductor layer, a first electrode and second electrode on the nitride semiconductor layer, a gate electrode, and a gate insulating layer between the nitride semiconductor layer and the gate electrode. The gate insulating layer has a first oxide region containing at least any one element of aluminum and boron, gallium, and silicon. When a distance between the first end portion and the second end portion of the first oxide region is defined as d1, and a position separated by d1/10 from the first end portion toward the second end portion is defined as a first position, an atomic concentration of gallium at the first position is 80% or more and 120% or less of that of the at least any one element.
Public/Granted literature
- US20180308950A1 SEMICONDUCTOR DEVICE, POWER SUPPLY CIRCUIT, AND COMPUTER Public/Granted day:2018-10-25
Information query
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