Invention Grant
- Patent Title: Semiconductor device with lifetime killers and method of manufacturing the same
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Application No.: US15863704Application Date: 2018-01-05
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Publication No.: US10347735B2Publication Date: 2019-07-09
- Inventor: Keishirou Kumada , Yuichi Hashizume , Yasuyuki Hoshi
- Applicant: Fuji Electric Co., Ltd.
- Applicant Address: JP Kanagawa
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kanagawa
- Agency: Chen Yoshimura LLP
- Priority: JP2017-024491 20170213
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L21/22 ; H01L29/06 ; H01L29/16 ; H01L29/167 ; H01L29/36 ; H01L29/417 ; H01L29/423 ; H01L29/66 ; H01L29/739 ; H01L29/78

Abstract:
A semiconductor device includes a semiconductor substrate, a first semiconductor layer of a first conductivity type, a second semiconductor layer of a second conductivity type, a first semiconductor region of the first conductivity type, a second semiconductor region of the second conductivity type, a gate insulating film, and a gate electrode. The semiconductor device further includes, in a region of the first semiconductor layer across or adjacent to a p-n junction therein that does not overlap the second semiconductor region in a plan view except lateral edges thereof, a lifetime killer region having lifetime killers implanted therein.
Public/Granted literature
- US20180233564A1 SEMICONDUCTOR DEVICE WITH LIFETIME KILLERS AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2018-08-16
Information query
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