Invention Grant
- Patent Title: High power gallium nitride electronics using miscut substrates
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Application No.: US15697161Application Date: 2017-09-06
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Publication No.: US10347736B2Publication Date: 2019-07-09
- Inventor: Isik C. Kizilyalli , Dave P. Bour , Thomas R. Prunty , Gangfeng Ye
- Applicant: Nexgen Power Systems, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Nexgen Power Systems, Inc.
- Current Assignee: Nexgen Power Systems, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: H01L29/20
- IPC: H01L29/20 ; H01L29/66 ; H01L29/861 ; H01L21/02 ; H01L21/76 ; H01L29/04 ; H01L29/06

Abstract:
A method of fabricating an electronic device includes providing a III-V substrate having a hexagonal crystal structure and a normal to a growth surface characterized by a misorientation from the direction of between 0.15° and 0.65°. The method also includes growing a first III-V epitaxial layer coupled to the III-V substrate and growing a second III-V epitaxial layer coupled to the first III-V epitaxial layer. The method further includes forming a first contact in electrical contact with the III-V substrate and forming a second contact in electrical contact with the second III-V epitaxial layer.
Public/Granted literature
- US20180166556A1 HIGH POWER GALLIUM NITRIDE ELECTRONICS USING MISCUT SUBSTRATES Public/Granted day:2018-06-14
Information query
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