Invention Grant
- Patent Title: Light-emitting element mounting substrate and light-emitting package using the same
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Application No.: US15438267Application Date: 2017-02-21
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Publication No.: US10347796B2Publication Date: 2019-07-09
- Inventor: Jung Hoon Kim , Jacob-Changlin Tarn , Il Woo Park
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2016-0025054 20160302
- Main IPC: H01L33/46
- IPC: H01L33/46 ; H01L33/48 ; H01L33/50 ; H01L33/62 ; H01L33/60

Abstract:
A light-emitting element mounting substrate is provided. The light-emitting element mounting substrate includes an insulating base plate comprising a first surface, a second surface facing the first surface, and a plurality of pad regions disposed on the first surface in an m-by-n matrix form, each of m and n being a natural number; a first conductive pad that is disposed in one of the plurality of pad regions and is in contact with the insulating base plate; a second conductive pad that is disposed in another one of the plurality of pad regions apart from the first conductive pad and is in contact with the insulating base plate; a first through hole disposed at a position corresponding to the first conductive pad to penetrate the insulating base plate; a second through hole that is disposed at a position corresponding to the second conductive pad to penetrate the insulating base plate and is spaced apart from the first through hole; a first through conduit filling the first through hole and being in contact with the first conductive pad; and a second through conduit filling the second through hole and being in contact with the second conductive pad.
Public/Granted literature
- US20170256682A1 LIGHT-EMITTING ELEMENT MOUNTING SUBSTRATE AND LIGHT-EMITTING PACKAGE USING THE SAME Public/Granted day:2017-09-07
Information query
IPC分类: