- Patent Title: Light emitting device package and light system including the same
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Application No.: US14931140Application Date: 2015-11-03
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Publication No.: US10347803B2Publication Date: 2019-07-09
- Inventor: Eun Dk Lee , Jung Hun Oh
- Applicant: LG INNOTEK CO., LTD.
- Applicant Address: KR Seoul
- Assignee: LG INNOTEK CO., LTD.
- Current Assignee: LG INNOTEK CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: Ked & Associates, LLP
- Priority: KR10-2014-0155156 20141110; KR10-2015-0006651 20150114
- Main IPC: H01L33/54
- IPC: H01L33/54 ; H01L33/56 ; H01L33/58 ; H01L33/48
Abstract:
A light emitting device package may include a package body, a light emitting device on the package body, a first molding member that surrounds the light emitting device, and a second molding member having a hemi-spherical structure to surround the first molding member. The molding member includes a viscous material.
Public/Granted literature
- US20160133804A1 LIGHT EMITTING DEVICE PACKAGE AND LIGHT SYSTEM INCLUDING THE SAME Public/Granted day:2016-05-12
Information query
IPC分类:
