A method of manufacturing a light emitting device, the method includes providing a light emitting element. Each of first and second pad electrodes is provided on a second outer surface. A first conductive member is bonded to the first pad electrode and a second conductive member is bonded to the second pad electrode so that a portion of each of the first and second conductive members protrudes from a plane including a first outer surface. The light emitting element and the first and second conductive members are covered with a light-shielding member so as to expose at least a portion of the main light emitting surface. The first and second conductive members and the light-shielding member which protrude from the plane are cut off along a direction intersecting the main light emitting surface.