Invention Grant
- Patent Title: Thermoelectric conversion module
-
Application No.: US16001157Application Date: 2018-06-06
-
Publication No.: US10347811B2Publication Date: 2019-07-09
- Inventor: Hideyuki Suzuki , Shinji Imai
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Minato-Ku, Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Minato-Ku, Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2015-248424 20151221
- Main IPC: H01L35/32
- IPC: H01L35/32 ; H01L35/30 ; H02N11/00 ; H01L35/08 ; H01L35/24 ; H01L35/34

Abstract:
Provided is a thermoelectric conversion module which is folded in a bellows-like shape and is capable of preventing a thermoelectric conversion layer from coming into contact with other member even in a state in which bellows is closed and performing highly effective power generation. This thermoelectric conversion module includes a bellows-like substrate, P-type and N-type thermoelectric conversion layers which are alternately provided on each sloped surface of the substrate on one surface of the substrate, a top portion electrode which connects the P-type and N-type thermoelectric conversion layers over a top portion and a bottom portion electrode which connects P-type and N-type thermoelectric conversion layers over a bottom portion, in which the P-type and N-type thermoelectric conversion layers do not extend over the top portion and the bottom portion, and positions of the P-type thermoelectric conversion layer and the N-type thermoelectric conversion layer which face each other are not overlapped as viewed in the arrangement direction.
Public/Granted literature
- US20180351070A1 THERMOELECTRIC CONVERSION MODULE Public/Granted day:2018-12-06
Information query
IPC分类: