Invention Grant
- Patent Title: Memory device and method of manufacturing the same
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Application No.: US15653043Application Date: 2017-07-18
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Publication No.: US10347832B2Publication Date: 2019-07-09
- Inventor: Yoshihisa Kagawa
- Applicant: Sony Semiconductor Solutions Corporation
- Applicant Address: JP Kanagawa
- Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee Address: JP Kanagawa
- Agency: Dentons US LLP
- Priority: JP2010-079695 20100330
- Main IPC: H01L27/24
- IPC: H01L27/24 ; H01L45/00 ; H01L27/112

Abstract:
A memory device includes: a memory layer that is isolated for each memory cell and stores information by a variation of a resistance value; an ion source layer that is formed to be isolated for each memory cell and to be laminated on the memory layer, and contains at least one kind of element selected from Cu, Ag, Zn, Al and Zr and at least one kind of element selected from Te, S and Se; an insulation layer that isolates the memory layer and the ion source layer for each memory cell; and a diffusion preventing barrier that is provided at a periphery of the memory layer and the ion source layer of each memory cell to prevent the diffusion of the element.
Public/Granted literature
- US20170317278A1 MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2017-11-02
Information query
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