Three-dimensional antennas incorporate a stack of planar wiring boards, with conductive metallization on each board and electrical connectivity between conductive regions on adjacent boards. In one example of the disclosed technology, a three-dimensional antenna is formed from a stack of planar wiring boards, where each includes one or more disjoint metallizations in electrical contact with at least one disjoint metallization on an adjacent one of the planar wiring boards. Associated methods and variants are also disclosed.