Invention Grant
- Patent Title: Contact
-
Application No.: US16081678Application Date: 2017-03-02
-
Publication No.: US10348008B2Publication Date: 2019-07-09
- Inventor: Tatsuya Nakamura , Kazushige Ueno
- Applicant: Kitagawa Industries Co., Ltd.
- Applicant Address: JP Aichi
- Assignee: Kitagawa Industries Co., Ltd.
- Current Assignee: Kitagawa Industries Co., Ltd.
- Current Assignee Address: JP Aichi
- Agency: Jenkins, Wilson, Taylor & Hunt, P.A.
- Priority: JP2016-040171 20160302
- International Application: PCT/JP2017/008299 WO 20170302
- International Announcement: WO2017/150673 WO 20170908
- Main IPC: H05K1/14
- IPC: H05K1/14 ; H01R12/57 ; H01R13/24 ; H01R4/02 ; H01R12/70 ; H01R43/02

Abstract:
The contact includes a base portion, a contact portion, and a spring portion integrally molded with a thin metal plate. The spring portion includes a first bending portion, a flat plate portion, and a second bending portion. The first bending portion is bent such that a first surface of the thin plate is on an outer peripheral side, and the second bending portion is bent such that a second surface of the thin plate is on an outer peripheral side. The thin plate has a thickness t of from 0.10 to 0.15 mm, a curvature radius R1 of the first bending portion is from 0.6 to 1.0 mm, and a ratio L/R1 of a length L between the first bending portion and the second bending portion of the flat plate portion to the curvature radius R1 is configured to satisfy 0
Public/Granted literature
- US20190027843A1 CONTACT Public/Granted day:2019-01-24
Information query