Invention Grant
- Patent Title: Substrate-mounted connector for electronic devices and manufacturing method thereof
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Application No.: US15822363Application Date: 2017-11-27
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Publication No.: US10348012B2Publication Date: 2019-07-09
- Inventor: Shukuyo Yamada , Masaya Hirashima , Tsuyoshi Kozai
- Applicant: KABUSHIKI KAISHA TOSHIBA
- Applicant Address: JP Minato-ku
- Assignee: KABUSHIKI KAISHA TOSHIBA
- Current Assignee: KABUSHIKI KAISHA TOSHIBA
- Current Assignee Address: JP Minato-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2017-119818 20170619
- Main IPC: H01R12/00
- IPC: H01R12/00 ; H05K1/00 ; H01R12/70 ; H01R43/18 ; H01R43/20 ; H01R4/02 ; H01R13/6585 ; H01R12/72 ; H01R13/405 ; H01R24/60
Abstract:
According to one embodiment, a connector includes an insulator and a contact terminal in which an end side is pressed into a counter-press-fit portion of the insulator, and the other end side comprises a soldered portion attached to a substrate with soldering. The contact terminal comprises a flux accumulation portion inside the counter-press-fit portion and/or in an extended end portion of the soldered portion.
Public/Granted literature
- US20180366849A1 CONNECTOR AND MANUFACTURING METHOD THEREOF Public/Granted day:2018-12-20
Information query
