Invention Grant
- Patent Title: Folded waveguide structure semiconductor laser
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Application No.: US15822961Application Date: 2017-11-27
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Publication No.: US10348055B2Publication Date: 2019-07-09
- Inventor: Ning Cheng
- Applicant: Futurewei Technologies, Inc.
- Applicant Address: US TX Plano
- Assignee: Futurewei Technologies, Inc.
- Current Assignee: Futurewei Technologies, Inc.
- Current Assignee Address: US TX Plano
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H01S5/40
- IPC: H01S5/40 ; H01S5/10 ; H01S3/03 ; H01S3/067 ; H01S3/07 ; H01S5/026 ; H01S5/042 ; H01S5/12

Abstract:
A laser apparatus is provided, comprising a semiconductor substrate, an active layer disposed on the semiconductor substrate, a folded waveguide disposed on the active layer and forming a resonant structure, the folded waveguide comprising at least two substantially straight waveguide portions coupled by a connecting waveguide structure, with the folded waveguide having a first end and a second end located at one or more edges of the semiconductor substrate, wherein at least one of the ends includes a mirror, and an electrode coupled to the folded waveguide and configured to create photons in the folded waveguide when receiving electrical power. The waveguide emits laser light comprising the photons, with the laser light emitted at an edge of the semiconductor substrate.
Public/Granted literature
- US20180191133A1 FOLDED WAVEGUIDE STRUCTURE SEMICONDUCTOR LASER Public/Granted day:2018-07-05
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