Invention Grant
- Patent Title: Submodule
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Application No.: US15869957Application Date: 2018-01-12
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Publication No.: US10348064B2Publication Date: 2019-07-09
- Inventor: Teag Sun Jung
- Applicant: LSIS CO., LTD.
- Applicant Address: KR Anyang-si, Gyeonggi-Do
- Assignee: LSIS CO., LTD.
- Current Assignee: LSIS CO., LTD.
- Current Assignee Address: KR Anyang-si, Gyeonggi-Do
- Agency: K&L Gates LLP
- Priority: KR10-2017-0055458 20170428
- Main IPC: H02B1/26
- IPC: H02B1/26 ; H02B1/24 ; H02B1/46 ; H02B1/52 ; H02B1/56 ; H02B1/20 ; H02J3/18 ; H02J3/28
Abstract:
A submodule includes a power pack including a plurality of switching modules, first and second input bus bars connected with the switching modules to protrude toward a first outside of the power pack and a bypass switch provided at the first outside of the power pack and coupled to the first and second input bus bars.
Public/Granted literature
- US20180316163A1 SUBMODULE Public/Granted day:2018-11-01
Information query
