A focal-plane array includes: an array of thermal sensors arranged in at least 120 rows and at least 160 columns, the thermal sensors being divided among three or more subarrays; and bias circuitry to concurrently pulse bias the thermal sensors of one of the rows of each of the subarrays, and to sequentially bias the rows of each of the subarrays at a rate of at least 40,000 rows per second. A readout integrated circuit includes: a sensing area to physically and electrically connect to the array of thermal sensors and includes row circuitry to perform the concurrent pulse biasing and the sequential biasing, and column circuitry to concurrently measure analog signals from the pulse-biased thermal sensors; and conversion circuitry to convert the measured analog signals to corresponding digital signals. In some embodiments, the thermal sensors are operated without cooling. In some embodiments, the rows are interleaved between the subarrays.