The present disclosure generally relates to acoustic assemblies. One acoustic assembly includes a base and a first die disposed on the base. The first die comprises a microelectromechanical system (MEMS) microphone that includes a first diaphragm and a first back plate. The MEMS microphone has a barometric release. The acoustic assembly also includes a second die disposed on the base. The second die comprises a pressure sensor. The acoustic assembly further includes a cover coupled to the base and enclosing the first dies and the second die. A back volume is formed between the base, the first die, the second die, and the cover. The pressure sensor is configured to sense a pressure of the back volume.