Invention Grant
- Patent Title: Overmolded electronic module with an integrated electromagnetic shield using SMT shield wall components
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Application No.: US14485504Application Date: 2014-09-12
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Publication No.: US10349568B2Publication Date: 2019-07-09
- Inventor: Philip H. Thompson , Larry D. Pottebaum
- Applicant: Skyworks Solutions, Inc.
- Applicant Address: US MA Woburn
- Assignee: Skyworks Solutions, Inc.
- Current Assignee: Skyworks Solutions, Inc.
- Current Assignee Address: US MA Woburn
- Agency: Knobbe, Martens, Olson & Bear, LLP
- Main IPC: H05K9/00
- IPC: H05K9/00 ; H01L23/552 ; H01L23/00 ; H05K3/34 ; H01L23/31 ; H05K3/00

Abstract:
According to certain aspects, a circuit board panel includes a first module circuit board and a second module circuit board arranged to define a space that runs between a first portion of the periphery of the first module circuit board and a portion of the periphery of the second module circuit board; and a plurality of shield components each extending across the space and including a first conductive portion mounted along the first portion of the periphery of the first module circuit board, a second conductive portion mounted along the portion of the periphery of the second module circuit board, and a non-conductive portion extending between the first conductive portion and the second conductive portion, the first and second conductive portions of each of the plurality of shield components configured to provide electromagnetic shielding for at least one electronic component mounted on the first and second module circuit boards, respectively.
Public/Granted literature
- US20150070861A1 OVERMOLDED ELECTRONIC MODULE WITH AN INTEGRATED ELECTROMAGNETIC SHIELD USING SMT SHIELD WALL COMPONENTS Public/Granted day:2015-03-12
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