• Patent Title: Electronic equipment data center or co-location facility designs and methods of making and using the same
  • Application No.: US15832664
    Application Date: 2017-12-05
  • Publication No.: US10356939B2
    Publication Date: 2019-07-16
  • Inventor: Rob Roy
  • Applicant: Switch, Ltd.
  • Applicant Address: US NV Las Vegas
  • Assignee: Switch, Ltd.
  • Current Assignee: Switch, Ltd.
  • Current Assignee Address: US NV Las Vegas
  • Agent Kevin D. Everage; Chad W. Miller
  • Main IPC: H05K7/20
  • IPC: H05K7/20
Electronic equipment data center or co-location facility designs and methods of making and using the same
Abstract:
The present invention relates to electronic equipment data center or co-location facility designs and methods of making and using the same in an environmentally aware manner, and generally provides apparatus and methods for using novel support bracket structures, and thermal panels associated with the same, that allow for distinct partitioning of air flowing in hot aisles and cold aisles, as well as for holding wiring above cabinets that are used to store electronic equipment in the facility.
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