A lamination molding apparatus, including a numerical control apparatus configured to form a desired lamination molding object by a repetition in accordance with a main program pre-created and numbered with a sequence number, the main program including a plurality of program lines, wherein the repetition includes forming a material powder layer of a predetermined thickness on a molding table for each divided layer, the molding table being vertically movable, the divided layer being obtained by dividing a shape of the desired lamination molding object at the predetermined thickness; and irradiating a predetermined area of the material powder layer with a laser beam to form a sintered layer.