Invention Grant
- Patent Title: Metal alloy shim for mounting printhead chips with high bonding strength
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Application No.: US16051319Application Date: 2018-07-31
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Publication No.: US10363736B2Publication Date: 2019-07-30
- Inventor: Jason Thelander , David Burke , Andrew Thomas , Simon Fielder , Michele Gimona , Albert Woffenden
- Applicant: Memjet Technology Limited
- Applicant Address: IE
- Assignee: Memjet Technology Limited
- Current Assignee: Memjet Technology Limited
- Current Assignee Address: IE
- Agency: Cooley LLP
- Main IPC: B41J2/14
- IPC: B41J2/14 ; B41J2/16 ; B41J2/19 ; B41J2/045 ; B41J2/175 ; B41J25/34

Abstract:
An inkjet printhead includes: a rigid elongate manifold having ink supply channels extending along its length and a plurality of ink outlets defined therein; a shim attached to the manifold, the shim having a plurality of shim apertures for receiving ink from the ink outlets; and a plurality of printhead chips adhesively bonded directly to the shim, each printhead chip receiving ink from one or more of the ink outlets. The shim is formed of a metal alloy having a CTE of 5 ppm/° C. or less and includes an adhesion-promoting surface film layer.
Public/Granted literature
- US20180370223A1 METAL ALLOY SHIM FOR MOUNTING PRINTHEAD CHIPS WITH HIGH BONDING STRENGTH Public/Granted day:2018-12-27
Information query
IPC分类: