Invention Grant
- Patent Title: Liquid ejecting head with connection mechanism for a flexible circuit and circuit board
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Application No.: US15807781Application Date: 2017-11-09
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Publication No.: US10363737B2Publication Date: 2019-07-30
- Inventor: Takahiro Kanegae , Katsuhiro Okubo , Hiroshige Owaki
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Workman Nydegger
- Priority: JP2016-220459 20161111
- Main IPC: B41J2/045
- IPC: B41J2/045 ; B41J2/14
Abstract:
A liquid ejecting head includes a pair of connectors that can be connected to each other, a flexible circuit on which one of the connectors is mounted, a circuit board on which another one of the connectors is mounted, a driver element that generates a driving force for ejecting liquid from a nozzle in response to an electric signal that is supplied from the flexible circuit to the circuit board via the pair of connectors, and a locking mechanism that locks connection between the connector of the circuit board and the connector of the flexible circuit.
Public/Granted literature
- US20180134035A1 LIQUID EJECTING HEAD Public/Granted day:2018-05-17
Information query
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