Invention Grant
- Patent Title: Cutting mechanism and recording apparatus
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Application No.: US15915725Application Date: 2018-03-08
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Publication No.: US10363759B2Publication Date: 2019-07-30
- Inventor: Yasushi Yajima
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Workman Nydegger
- Priority: JP2017-059257 20170324
- Main IPC: B41J11/70
- IPC: B41J11/70 ; B65H35/00 ; B65H20/02 ; B65H35/06 ; B26D1/18 ; B26D1/24 ; B26D5/08 ; F16H19/04

Abstract:
There is provided a cutting mechanism including: a cutter blade that can cut a medium, a cutter unit to which the cutter blade is attached, a first pinion gear that is rotatably attached to the cutter unit, and a rack gear that can mesh with the first pinion gear, in which the first pinion gear and the rack gear are configured with inclined teeth, and the cutter unit moves while the pinion gear is rotated in state of meshing the pinion gear and the rack gear.
Public/Granted literature
- US20180272761A1 CUTTING MECHANISM AND RECORDING APPARATUS Public/Granted day:2018-09-27
Information query
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