Invention Grant
- Patent Title: Electronics cooling with multi-phase heat exchange and heat spreader
-
Application No.: US15497520Application Date: 2017-04-26
-
Publication No.: US10365047B2Publication Date: 2019-07-30
- Inventor: Stefano Lassini , Brian Rush , Daniel Erno , William Dwight Gerstler
- Applicant: GE Aviation Systems LLC
- Applicant Address: US MI Grand Rapids
- Assignee: GE Aviation Systems LLC
- Current Assignee: GE Aviation Systems LLC
- Current Assignee Address: US MI Grand Rapids
- Agency: Dority & Manning, P.A.
- Main IPC: F28F7/00
- IPC: F28F7/00 ; F28D15/04 ; F28D9/00 ; F28F7/02 ; F28D15/02 ; H05K7/20 ; F28D7/00 ; F28D20/02 ; F28F1/04 ; H01L23/427

Abstract:
One example aspect of the present disclosure is directed to a system for cooling a surface. The system can include a housing. The housing can include an evaporator portion. The housing can include at least one trifurcated heat exchange portion. The at least one trifurcated heat exchange portion can include a condenser portion coupled to the evaporator portion. The at least one trifurcated heat exchange portion can include a coolant portion substantially surrounded by the condenser portion. The at least one trifurcated heat exchange portion can include a phase change material portion substantially surrounding the condenser portion.
Public/Granted literature
- US20170363363A1 Electronics Cooling with Multi-Phase Heat Exchange and Heat Spreader Public/Granted day:2017-12-21
Information query