Invention Grant
- Patent Title: Microchannel heat exchanger
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Application No.: US15758542Application Date: 2016-08-19
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Publication No.: US10365051B2Publication Date: 2019-07-30
- Inventor: Kaijian Wang
- Applicant: FUJITSU GENERAL LIMITED
- Applicant Address: JP Kanagawa
- Assignee: FUJITSU GENERAL LIMITED
- Current Assignee: FUJITSU GENERAL LIMITED
- Current Assignee Address: JP Kanagawa
- Agency: Paratus Law Group, PLLC
- Priority: JP2015-177800 20150909
- International Application: PCT/JP2016/074189 WO 20160819
- International Announcement: WO2017/043286 WO 20170316
- Main IPC: F28F27/00
- IPC: F28F27/00 ; F28F3/04 ; F25B49/02 ; G01K1/14 ; G01K13/02 ; F28D9/00 ; F28F3/08 ; G01K1/02 ; F28F9/02 ; F28F13/08 ; F28F13/12 ; F28D21/00

Abstract:
This microchannel heat exchanger includes: a heat exchanger body including a channel layer stack formed in such a manner that a plurality of high-temperature channel layers provided with a channel for a high-temperature fluid and a plurality of low-temperature channels layers provided with a channel for a low-temperature fluid are alternately stacked, an inlet and an outlet for the high-temperature fluid, and an inlet and an outlet for the low-temperature fluid; and a control board that is fixed in a stacking direction of the heat exchanger body, and that at least installs a plurality of temperature sensors that are inserted in the stacking method of the heat exchanger body in such a manner that a sensing point is arranged near each of the inlet and the outlet for the high-temperature fluid and the inlet and the outlet for the low-temperature fluid.
Public/Granted literature
- US20180259273A1 MICROCHANNEL HEAT EXCHANGER Public/Granted day:2018-09-13
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