Invention Grant
- Patent Title: Method and system for monitoring temperature of wafer
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Application No.: US15434201Application Date: 2017-02-16
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Publication No.: US10365672B2Publication Date: 2019-07-30
- Inventor: Shu-Han Chen , Sheng-Hung Lin , Han-Hsuan Hsu , Chien-Fang Lin
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: G06F19/00
- IPC: G06F19/00 ; G05D23/19 ; H01L21/67

Abstract:
A system includes a cooling device, a memory, and a processor. The cooling device is configured to detect a temperature of a wafer and to provide air to the wafer. The memory is configured to store computer program codes. The processor is configured to execute the computer program codes in the memory to: determine whether the temperature of the wafer meet a predetermined requirement; adjust the temperature of the wafer on condition that the temperature does not meet the predetermined requirement; and control the cooling device to detect the temperature of the wafer again, in order to verify whether an adjusted temperature of the wafer meet predetermined requirement.
Public/Granted literature
- US20180166309A1 METHOD AND SYSTEM FOR MONITORING TEMPERATURE OF WAFER Public/Granted day:2018-06-14
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