Invention Grant
- Patent Title: Computer case cooling structure
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Application No.: US15696114Application Date: 2017-09-05
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Publication No.: US10365699B2Publication Date: 2019-07-30
- Inventor: Tai-Sheng Han
- Applicant: EVGA CORPORATION
- Applicant Address: TW New Taipei
- Assignee: EVGA CORPORATION
- Current Assignee: EVGA CORPORATION
- Current Assignee Address: TW New Taipei
- Agent Leong C. Lei
- Main IPC: G06F1/18
- IPC: G06F1/18 ; G06F1/20

Abstract:
A computer case cooling structure, including: a case body; at least one control element, configured on a long edge side of the case body; a partition plate, configured inside the case body, thereby dividing the inside of the case body into a first cooling space and second cooling space; a cover body, coupled pivotally to one side of the cover body, thereby rotatable around a shot edge side of the case body; a cooling door assembly, configured movably on the case body; a first fan assembly, configured on the case body and corresponding to the first cooling space; and a second fan assembly, configured on the case body and corresponding to the second cooling space. Whereby, the heat generated from interface cards can be discharged through the first cooling space, and the heat generated from a central processing unit the second cooling space, achieving independent cooling without interference.
Public/Granted literature
- US20190073005A1 COMPUTER CASE COOLING STRUCTURE Public/Granted day:2019-03-07
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