Invention Grant
- Patent Title: RFIC device and method for manufacturing resin molded body including RFIC device
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Application No.: US15676140Application Date: 2017-08-14
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Publication No.: US10366321B2Publication Date: 2019-07-30
- Inventor: Kunihiro Komaki , Shunji Mandai , Kengo Matsumoto
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo-Shi, Kyoto-Fu
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Nagaokakyo-Shi, Kyoto-Fu
- Agency: Arent Fox LLP
- Priority: JP2015-039316 20150227
- Main IPC: H01Q1/38
- IPC: H01Q1/38 ; H01Q7/00 ; G06K19/077 ; H01L21/56 ; H01L23/29 ; H01L23/31 ; H01Q1/22

Abstract:
An RFIC device including a resin block having a first surface, a second surface that faces the first surface, and a through-hole that extends through the first surface and the second surface. Moreover, the RFIC device includes an RFIC element that is embedded in the resin block and a coil antenna disposed in the resin block that is connected with the RFIC element and that has a central axis that extends from the first surface to the second surface. In addition, the through-hole extends inside the coil antenna.
Public/Granted literature
- US20170344872A1 RFIC DEVICE AND METHOD FOR MANUFACTURING RESIN MOLDED BODY INCLUDING RFIC DEVICE Public/Granted day:2017-11-30
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