Invention Grant
- Patent Title: Semiconductor device and method of manufacturing semiconductor device
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Application No.: US15936436Application Date: 2018-03-27
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Publication No.: US10366891B2Publication Date: 2019-07-30
- Inventor: Shinya Takashima , Katsunori Ueno , Masaharu Edo
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kanagawa
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kanagawa
- Priority: JP2017-074037 20170403
- Main IPC: H01L29/207
- IPC: H01L29/207 ; H01L21/225 ; H01L29/20 ; H01L29/66 ; H01L21/265 ; H01L29/78 ; H01L29/08 ; H01L29/10 ; H01L21/266

Abstract:
A vertical semiconductor apparatus includes: a gallium nitride substrate; a gallium nitride semiconductor layer on the gallium nitride substrate; a p-type impurity region in the gallium nitride semiconductor layer and having an element to function as an acceptor for gallium nitride; an n-type impurity region in the p-type impurity region and having an element to function as a donor for gallium nitride; and an electrode provided contacting a rear surface of the gallium nitride substrate. The element to function as the donor in the n-type impurity region includes: a first impurity element to enter sites of gallium atoms in the gallium nitride semiconductor layer; and a second impurity element different from the first impurity element and to enter sites of nitrogen atoms in the gallium nitride semiconductor layer. In the n-type impurity region, a concentration of the first impurity element is higher than that of the second impurity element.
Public/Granted literature
- US20190115215A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2019-04-18
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