Invention Grant
- Patent Title: Electronic package and its package substrate
-
Application No.: US15823831Application Date: 2017-11-28
-
Publication No.: US10366906B2Publication Date: 2019-07-30
- Inventor: Chun-Hsien Yu , Hsien-Ming Tsai
- Applicant: PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Applicant Address: TW Hsinchu County
- Assignee: PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Current Assignee: PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Current Assignee Address: TW Hsinchu County
- Agency: Amin, Turocy & Watson LLP
- Priority: TW106213140U 20170905
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L21/56 ; H01L21/48 ; H01L23/31 ; H05K1/02
Abstract:
The present disclosure provides an electronic package, including a package substrate and an electronic component formed on the package substrate. The substrate includes an insulating portion, a wiring portion embedded in the insulating portion, and a metal board disposed on the insulating portion and in contact with the wiring portion. The metal board is provided with a plurality of electrical contacts and a heat dissipating portion. The metal board can maintain a predefined heat dissipation area via the heat dissipating portion, and be connected to a circuit board via the electrical contacts.
Public/Granted literature
- US20190074196A1 ELECTRONIC PACKAGE AND ITS PACKAGE SUBSTRATE Public/Granted day:2019-03-07
Information query
IPC分类:
