A chip bonding apparatus for bonding a chip and a redistribution structure with each other is provided. The chip bonding apparatus includes a pick and place module and an alignment module. The pick and place module is suitable for picking up and placing the chip. The alignment module is movably connected to the pick and place module. The alignment module includes at least one alignment protrusion, wherein the at least one alignment protrusion extends toward at least one alignment socket included in the redistribution structure. Furthermore, a chip bonding method and a chip package structure are provided.