Invention Grant
- Patent Title: 3D semiconductor memory device
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Application No.: US15283961Application Date: 2016-10-03
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Publication No.: US10367001B2Publication Date: 2019-07-30
- Inventor: Ki Hong Lee , Seung Ho Pyi , Seok Min Jeon
- Applicant: SK hynix Inc.
- Applicant Address: KR Icheon-si, Gyeonggi-do
- Assignee: SK hynix Inc.
- Current Assignee: SK hynix Inc.
- Current Assignee Address: KR Icheon-si, Gyeonggi-do
- Agency: William Park & Associates Ltd.
- Priority: KR10-2012-0059920 20120604
- Main IPC: H01L27/115
- IPC: H01L27/115 ; H01L27/11582 ; H01L27/1157 ; H01L27/11565

Abstract:
Provided herein a semiconductor device including a stack including conductive layers and insulating layers that are alternately stacked, and a slit insulating layer passing through the stack in a stacking direction, the slit insulating layer including a first main pattern extending in a first direction, and a first protruding pattern protruding in a second direction crossing the first direction at an end of the first main pattern.
Public/Granted literature
- US10096614B2 3D semiconductor memory device Public/Granted day:2018-10-09
Information query
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