Invention Grant
- Patent Title: Air gap spacer with controlled air gap height
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Application No.: US15884934Application Date: 2018-01-31
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Publication No.: US10367076B1Publication Date: 2019-07-30
- Inventor: Kangguo Cheng , Xin Miao , Wenyu Xu , Chen Zhang
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Agent Vazken Alexanian
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L31/062 ; H01L29/66 ; H01L21/762 ; H01L29/06 ; H01L29/417 ; H01L29/78 ; H01L29/49

Abstract:
A FinFET and method for fabricating an air gap spacer in a FinFET is disclosed. The FinFET includes a sidewall spacer between a gate material and an interlayer dielectric material. The sidewall spacer includes a lower portion that extends fully between the gate and the interlayer dielectric material and an upper portion that includes an airgap. The sidewall spacer is fabricated by depositing a sacrificial gate structure in a gate region having an upper sacrificial layer and a lower sacrificial layer, and removing the upper sacrificial layer to expose a sidewall spacer region. Airgap spacer material is deposited in the exposed sidewall spacer region to form an upper portion of the sidewall spacer having the air gap.
Public/Granted literature
- US20190237560A1 AIR GAP SPACER WITH CONTROLLED AIR GAP HEIGHT Public/Granted day:2019-08-01
Information query
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