Invention Grant
- Patent Title: Trench vertical JFET with ladder termination
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Application No.: US16036305Application Date: 2018-07-16
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Publication No.: US10367099B2Publication Date: 2019-07-30
- Inventor: Zhongda Li , Anup Bhalla
- Applicant: United Silicon Carbide, Inc.
- Applicant Address: US NJ Monmouth Junction
- Assignee: United Silicon Carbide, Inc.
- Current Assignee: United Silicon Carbide, Inc.
- Current Assignee Address: US NJ Monmouth Junction
- Agency: BakerHostetler LLP
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L29/812 ; H01L29/06 ; H01L29/66 ; H01L29/47 ; H01L21/04 ; H01L21/768 ; H01L29/45 ; H01L29/808 ; H01L29/10 ; H01L29/16

Abstract:
A vertical JFET with a ladder termination may be made by a method using a limited number of masks. A first mask is used to form mesas and trenches in active cell and termination regions simultaneously. A mask-less self-aligned process is used to form silicide source and gate contacts. A second mask is used to open windows to the contacts. A third mask is used to pattern overlay metallization. An optional fourth mask is used to pattern passivation. Optionally the channel may be doped via angled implantation, and the width of the trenches and mesas in the active cell region may be varied from those in the termination region.
Public/Granted literature
- US20180342626A1 Trench Vertical JFET With Ladder Termination Public/Granted day:2018-11-29
Information query
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