Invention Grant
- Patent Title: Semiconductor element, semiconductor device, and method for manufacturing same
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Application No.: US15526473Application Date: 2015-08-13
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Publication No.: US10367100B2Publication Date: 2019-07-30
- Inventor: Makoto Shimizu , Hiroki Itoh , Tadao Ishibashi , Isamu Kotaka
- Applicant: NTT ELECTRONICS CORPORATION
- Applicant Address: JP Kanagawa
- Assignee: NTT ELECTRONICS CORPORATION
- Current Assignee: NTT ELECTRONICS CORPORATION
- Current Assignee Address: JP Kanagawa
- Agency: Ohlandt, Greeley, Ruggiero & Perle, L.L.P.
- Priority: JP2014-231806 20141114
- International Application: PCT/JP2015/072937 WO 20150813
- International Announcement: WO2016/075973 WO 20160519
- Main IPC: H01L29/205
- IPC: H01L29/205 ; H01L29/861 ; H01Q23/00 ; H01L29/66 ; H01L29/36 ; H01L29/06

Abstract:
A semiconductor element capable of adjusting a barrier height ϕBn and performing zero-bias operation and impedance matching with an antenna for improving detection sensitivity of high-frequency RF electric signals, a method of manufacturing the same, and a semiconductor device having the same. In the semiconductor element, a concentration of InGaAs (n-type InGaAs layer) is intentionally set to be high over a range for preventing the “change of the barrier height caused by the bias” described above up to a deep degeneration range. An electron Fermi level (EF) increases from a band edge of InGaAs (n-type InGaAs layer) to a band edge of InP (InP depletion layer).
Public/Granted literature
- US20170323981A1 SEMICONDUCTOR ELEMENT, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SAME Public/Granted day:2017-11-09
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