- Patent Title: Apparatus and method for transferring micro light-emitting diodes
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Application No.: US15551282Application Date: 2017-06-20
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Publication No.: US10367117B2Publication Date: 2019-07-30
- Inventor: Macai Lu , Jiangbo Yao
- Applicant: Shenzhen China Star Optoelectronics Technology Co., Ltd.
- Applicant Address: CN Shenzhen, Guangdong
- Assignee: SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee: SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Shenzhen, Guangdong
- Agent Leong C. Lei
- Priority: CN201710369880 20170523
- International Application: PCT/CN2017/089260 WO 20170620
- International Announcement: WO2018/214201 WO 20181129
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L33/00 ; H01L21/683 ; H01L33/20

Abstract:
The present invention provides an apparatus and a method for transferring micro light-emitting diodes. Said apparatus for transferring the micro light-emitting diodes comprises a main body, and a spraying module, a cooling module and a heating module disposed on said main body. The spraying module sprays metallic adhesive liquid onto the micro light-emitting diodes that wait to transfer, the cooling module cools the metallic adhesive liquid on the wait-to-transfer micro light-emitting diodes, thereby curing the metallic adhesive liquid to adhesively bond the main body with the wait-to-transfer micro light-emitting diodes together implementing the transfer of the micro light-emitting diodes, After transferred to reach the position, the cured metallic adhesive liquid is heated by the heating module, thereby melting the metallic adhesive liquid to separate the main body from the wait-to-transfer micro light-emitting diodes. This is capable of lowering the difficulty of transferring the micro light-emitting diodes, and enhancing the efficiently of transferring the micro light-emitting diodes.
Public/Granted literature
- US20180342643A1 APPARATUS AND METHOD FOR TRANSFERRING MICRO LIGHT-EMITTING DIODES Public/Granted day:2018-11-29
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