Invention Grant
- Patent Title: Electrical connector having a high speed signal transmission with a high-density structure
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Application No.: US15570485Application Date: 2016-04-26
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Publication No.: US10367305B2Publication Date: 2019-07-30
- Inventor: Takahiro Kondo , Tetsugaku Tanaka
- Applicant: FUJITSU COMPONENT LIMITED
- Applicant Address: JP Tokyo
- Assignee: FUJITSU COMPONENT LIMITED
- Current Assignee: FUJITSU COMPONENT LIMITED
- Current Assignee Address: JP Tokyo
- Agency: IPUSA, PLLC
- Priority: JP2015-095423 20150508
- International Application: PCT/JP2016/062955 WO 20160426
- International Announcement: WO2016/181816 WO 20161117
- Main IPC: H01R13/24
- IPC: H01R13/24 ; H01R13/6471 ; G01R1/067 ; H01R12/79 ; H01R13/6585 ; H01R9/05 ; G01R3/00 ; H01R12/71 ; H01R107/00
Abstract:
A connector includes multiple contact sets that are aligned. Each of the contact sets includes a signal contact for signal transmission and multiple ground contacts. The ground contacts include respective shield portions. The ground contacts are provided around the signal contact in such a manner as to surround the signal contact by the respective shield portions.
Public/Granted literature
- US20180145457A1 CONNECTOR Public/Granted day:2018-05-24
Information query
