Invention Grant
- Patent Title: Wafer-level-packaged BAW devices with surface mount connection structures
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Application No.: US15727117Application Date: 2017-10-06
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Publication No.: US10367470B2Publication Date: 2019-07-30
- Inventor: Matthew L. Wasilik , Buu Quoc Diep , Ian Y. Yee , Bang Nguyen , Ebrahim Andideh , Robert Kraft
- Applicant: Qorvo US, Inc.
- Applicant Address: US NC Greensboro
- Assignee: Qorvo US, Inc.
- Current Assignee: Qorvo US, Inc.
- Current Assignee Address: US NC Greensboro
- Agency: Withrow & Terranova, P.L.L.C.
- Main IPC: H03H9/10
- IPC: H03H9/10 ; H03H9/17 ; H01L41/29 ; H03H9/02 ; H03H9/05 ; H01L41/083 ; H03H9/00

Abstract:
The present disclosure relates to a Wafer-Level-Packaged (WLP) Bulk Acoustic Wave (BAW) device that includes a BAW resonator, a WLP enclosure, and a surface mount connection structure. The BAW resonator includes a piezoelectric layer with an opening and a bottom electrode lead underneath the piezoelectric layer, such that a portion of the bottom electrode lead is exposed through the opening of the piezoelectric layer. The WLP enclosure includes a cap and an outer wall that extends from the cap toward the piezoelectric layer to form a cavity. The opening of the piezoelectric layer is outside the cavity. The surface mount connection structure covers a portion of a top surface of the cap and extends continuously over a side portion of the WLP enclosure and to the exposed portion of the bottom electrode lead through the opening of the piezoelectric layer.
Public/Granted literature
- US20180109237A1 WAFER-LEVEL-PACKAGED BAW DEVICES WITH SURFACE MOUNT CONNECTION STRUCTURES Public/Granted day:2018-04-19
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