Invention Grant
- Patent Title: Method and package for packaging a thermal conductive strip with power supply terminals
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Application No.: US15207489Application Date: 2016-07-11
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Publication No.: US10368400B2Publication Date: 2019-07-30
- Inventor: Chen-San Cheng
- Applicant: TAIWAN TECH CO., LTD.
- Applicant Address: TW Changhua County
- Assignee: TAIWAN TECH CO., LTD.
- Current Assignee: TAIWAN TECH CO., LTD.
- Current Assignee Address: TW Changhua County
- Agency: Bruce Stone LLP
- Agent Joseph Bruce
- Main IPC: H05B3/14
- IPC: H05B3/14 ; H05B3/34 ; B32B38/10 ; H05B3/06 ; B29K101/12 ; B29L31/00

Abstract:
A thermal conductive strip with a power supply terminal includes: a carbon fiber unit including a carbon fiber connecting end; a plastic envelope which encapsulates the carbon fiber unit and has a length smaller than a length of the carbon fiber connecting end, and further includes a broken portion which covers a part of the carbon fiber connecting end; and the power supply terminal sleeved onto the broken portion and the carbon fiber connecting end, and including a clamping section for clamping the broken portion, and an electrically conductive section for contacting the carbon fiber connecting end. The power supply terminal is partially clamped on the plastic envelope and partially eclectically connected to the carbon fiber, which improves the yield rate and the bending durability of the thermal conductive strip of the present invention.
Public/Granted literature
- US20180014356A1 METHOD AND PACKAGE FOR PACKAGING A THERMAL CONDUCTIVE STRIP WITH POWER SUPPLY TERMINALS Public/Granted day:2018-01-11
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