Invention Grant
- Patent Title: Connection body, method for manufacturing connection body, and method for inspecting same
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Application No.: US15580856Application Date: 2016-06-14
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Publication No.: US10368443B2Publication Date: 2019-07-30
- Inventor: Reiji Tsukao
- Applicant: DEXERIALS CORPORATION
- Applicant Address: JP Osaka
- Assignee: DEXERIALS CORPORATION
- Current Assignee: DEXERIALS CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Oliff PLC
- Priority: JP2015-120969 20150616
- International Application: PCT/JP2016/067620 WO 20160614
- International Announcement: WO2016/204136 WO 20161222
- Main IPC: H05K1/18
- IPC: H05K1/18 ; G02F1/1345 ; H05K1/02 ; H05K1/11 ; H05K3/30 ; H05K3/32
Abstract:
A connection body for which a determination of the pass/fail of the electrical continuity can be made by an indentation inspection and in which conduction reliability is ensured.
Public/Granted literature
- US20180168044A1 CONNECTION BODY, METHOD FOR MANUFACTURING CONNECTION BODY, AND METHOD FOR INSPECTING SAME Public/Granted day:2018-06-14
Information query
