Invention Grant
- Patent Title: Fingerprint module, method for manufacturing the fingerprint module, and mobile terminal
-
Application No.: US15677415Application Date: 2017-08-15
-
Publication No.: US10368444B2Publication Date: 2019-07-30
- Inventor: Wenzhen Zhang
- Applicant: Guangdong Oppo Mobile Telecommunications Corp., LTD.
- Applicant Address: CN Dongguan
- Assignee: Guangdong Oppo Mobile Telecommunications Corp., Ltd.
- Current Assignee: Guangdong Oppo Mobile Telecommunications Corp., Ltd.
- Current Assignee Address: CN Dongguan
- Agency: Young Basile Hanlon & MacFarlane, P.C.
- Priority: CN201610675359 20160816; CN201620888908U 20160816
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K1/11 ; H05K1/14 ; H04M1/02 ; G06K9/00 ; H05K1/02 ; H05K3/30 ; H05K3/36 ; H05K5/03 ; G06F1/16
Abstract:
A fingerprint module includes a cover plate, a fingerprint chip, an intermediate board, and a circuit board. An assembling region is disposed on the cover plate. The fingerprint chip is fixed in the assembling region. The intermediate board is bonded to one surface of the fingerprint chip opposite to the cover plate to press the fingerprint chip. The circuit board is electrically connected to the fingerprint chip via the intermediate board.
Public/Granted literature
- US20180054896A1 Fingerprint Module, Method For Manufacturing The Fingerprint Module, And Mobile Terminal Public/Granted day:2018-02-22
Information query
