Invention Grant
- Patent Title: Shock absorbing structure adapted for a circuit board of an electronic device and electronic device therewith
-
Application No.: US15677034Application Date: 2017-08-15
-
Publication No.: US10368454B2Publication Date: 2019-07-30
- Inventor: Heng-Min Liu , Chun-Wang Lin , Chin-Chung Hung , Tsung-Hsien Chen , Shih-Wei Tung
- Applicant: Wistron Corporation
- Applicant Address: TW New Taipei
- Assignee: Wistron Corporation
- Current Assignee: Wistron Corporation
- Current Assignee Address: TW New Taipei
- Agent Winston Hsu
- Priority: TW106108853A 20170317
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H05K5/03 ; H05K5/02 ; H05K1/02
Abstract:
A shock absorbing structure includes at least one protruding column and at least one resilient module. The at least one protruding column is fixed on an electronic device and passes through a circuit board of the electronic device. The at least one resilient module is disposed between the at least one protruding column and the circuit board. When the electronic device is affected by an external shock load, the at least one resilient module is forced by the circuit board to be deformed for generating a resilient force. When the at least one resilient module is not forced by the circuit board any more, the resilient force generated by the at least one resilient module drives the circuit board to recover.
Public/Granted literature
Information query
