Invention Grant
- Patent Title: Process for producing sputtering target and sputtering target
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Application No.: US15770857Application Date: 2017-07-10
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Publication No.: US10369656B2Publication Date: 2019-08-06
- Inventor: Mikio Takigawa , Toshiyuki Terasawa
- Applicant: SUMITOMO CHEMICAL COMPANY, LIMITED
- Applicant Address: JP Tokyo
- Assignee: SUMITOMO CHEMICAL COMPANY, LIMITED
- Current Assignee: SUMITOMO CHEMICAL COMPANY, LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2016-138711 20160713
- International Application: PCT/JP2017/025145 WO 20170710
- International Announcement: WO2018/012461 WO 20180118
- Main IPC: B23K20/02
- IPC: B23K20/02 ; C23C14/34

Abstract:
A process for producing a sputtering target in which a target material is diffusion-bonded to a top face of a backing plate material, the process comprising:a step of heating the top face of the target material by a hot plate while pressing from above thereby diffusion-bonding the target material to the backing plate material in such a manner that the step is performed at a center part prior to an outer peripheral part of the top face.
Public/Granted literature
- US20180304400A1 PROCESS FOR PRODUCING SPUTTERING TARGET AND SPUTTERING TARGET Public/Granted day:2018-10-25
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