Invention Grant
- Patent Title: Buffing pad centering system
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Application No.: US14071408Application Date: 2013-11-04
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Publication No.: US10369683B2Publication Date: 2019-08-06
- Inventor: Richard Umbrell
- Applicant: BUFF AND SHINE MANUFACTURING, INC.
- Applicant Address: US CA Rancho Dominguez
- Assignee: Buff and Shine Mfg. Inc
- Current Assignee: Buff and Shine Mfg. Inc
- Current Assignee Address: US CA Rancho Dominguez
- Agency: Fitzsimmons IP Law
- Main IPC: A47L11/14
- IPC: A47L11/14 ; B24B29/00 ; B24D13/14 ; A47L11/40 ; A47L11/162 ; B24D13/20

Abstract:
In general, a Buffing Pad Centering System (“BPCS”) for centering a back plate having an edge and a front surface is described. In an example of an implementation of the BPCS, the BPCS may include a centering ring having a top boundary and a bottom boundary and a buffing pad attached to the bottom boundary of the centering ring, where the centering ring is centered on the buffing pad. The centering ring may include a cylindrical vertical member extending between the top boundary and bottom boundary, where the cylindrical vertical member has an inner cylindrical surface and an outer cylindrical surface, and where the inner cylindrical surface is capable of snuggly receiving the back plate.
Public/Granted literature
- US20140127981A1 BUFFING PAD CENTERING SYSTEM Public/Granted day:2014-05-08
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